1. 2. 3. material content data sheet sales product name ipw60r099cpa issued 29. august 2013 ma# MA000772922 package pg-to247-3-41 weight* 6051.68 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 15.501 0.26 0.26 2561 2561 leadframe non noble metal iron 7439-89-6 0.530 0.01 88 inorganic material phosphorus 7723-14-0 0.159 0.00 26 non noble metal copper 7440-50-8 529.068 8.74 8.75 87425 87539 wire non noble metal aluminium 7429-90-5 3.859 0.06 0.06 638 638 encapsulation organic material carbon black 1333-86-4 19.927 0.33 3293 plastics epoxy resin - 378.606 6.26 62562 inorganic material silicondioxide 60676-86-0 1594.131 26.34 32.93 263419 329274 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5267 5267 plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4803 4803 solder non noble metal antimony 7440-36-0 0.648 0.01 107 noble metal silver 7440-22-4 1.619 0.03 268 non noble metal tin 7440-31-5 4.210 0.07 0.11 696 1071 heatspreader inorganic material phosphorus 7723-14-0 1.033 0.02 171 non noble metal iron 7439-89-6 3.442 0.06 569 non noble metal copper 7440-50-8 3438.006 56.80 56.88 568107 568847 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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